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Microwave and Millimeter-Wave Electronic PackagingBy Rick Sturdivant
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Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs.
- Sales Rank: #2576389 in Books
- Published on: 2014-03-17
- Original language: English
- Number of items: 1
- Dimensions: 9.10" h x .90" w x 6.30" l, 1.25 pounds
- Binding: Hardcover
- 261 pages
About the Author
Rick Sturdivant has 23 years of industry experience in the design of modules, packages, and integrated circuits for microwave and millimeter-wave applications. He currently works as a consultant and in business development. He earned his M.S in electrical engineering from UCLA.
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